Invensas Signs BVA® Technology License and Development Agreement with ASE

SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas Corporation signed a new technology license and development agreement with Advanced Semiconductor Engineering, Inc. ("ASE") (TAIEX:2311, NYSE:ASX), the world’s largest semiconductor assembly and test service provider, to collaborate on the development and commercialization of Invensas Bond Via Array™ (BVA®) technology. ASE will move to the final stage of qualification of Invensas BVA® vertical interconnect technology for Package-on-Package (PoP) applications and begin engaging customers. With Invensas BVA technology, ASE will be able to meet its customers’ desire for low profile and low cost PoP solutions for current and future generations of application processors aimed at smartphones and tablets.