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US Patent Applications (USPTO)·

New patent application published for: COPPER-ALUMINUM BUSBAR WITH INTERLOCK INTERFACE

A busbar with an interlock interface includes an aluminum (Al) body. The Al body includes an upper surface and a lower surface opposing the upper surface. The busbar further includes a first copper (Cu) coil embedded within the Al body. The first Cu coil includes a first outer surface flush with the upper surface of the Al body. The first Cu coil further includes a first inner surface opposing the first outer surface. The first Cu coil further includes a first set of side surfaces positioned between and connected to the first outer surface and the first inner surface. The first Cu coil further includes a first edge formed by the connection of the first set of side surfaces and the first inner surface. The first edge defines a first angle between 20 and 70 degrees.

Company
GM Global Technology Operations LLC
Keywords
H02G5/02, H01F27/28