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ACM Research Enhances Single-Wafer Hot SPM System with Sulfuric Acid Recycle Capability

ACMR
  • ACM Research announced an enhanced 170°C Single-Wafer Hot SPM system featuring a new sulfuric acid recycle capability.
  • The system has been validated by a foundry customer across more than 50 process layers for broad cleaning applications.
  • The platform achieves particle counts of 15 or fewer at 15 nm and above, outperforming mainstream market solutions.
  • Proprietary nozzle design prevents crystalline deposits from acid mist, eliminating the need for periodic DI water chamber cleaning.
  • The new recycle capability achieves a 70% sulfuric acid recovery rate while maintaining strict particle control specifications.
  • The innovation is expected to save approximately 400 tons of sulfuric acid per tool annually, reducing costs & environmental impact.
  • ACM's Single-Wafer Hot SPM system supports applications including photoresist stripping, organic residue removal, & post-CMP cleaning.
  • The technology aims to improve yields in logic & memory applications while reducing equipment maintenance requirements.
  • Dr. David Wang, ACM's President & CEO, stated the advancement addresses complex manufacturing needs & customer validation.
  • Forward-looking statements in the release are subject to risks & uncertainties that could cause actual results to differ from expectations.