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ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:ASX, IEX:3711), today announced Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon Via (TSV),