DoD Announces $10 Million Defense Production Act Title III Agreement With Six Sigma to Strengthen the Domestic Microelectronics Industrial Base

As part of the nation's effort to sustain the microelectronics manufacturing capability necessary for national and economic security, and in support of Executive Order 14017, America's Supply Chains, the Department of Defense recently entered a $10 million agreement with Six Sigma utilizing Defense Production Act (DPA) Title III authorities. Six Sigma will increase the capacity of both its copper solder column manufacturing and column attach processes to enable the production of high-reliability Column Grid Array components (such as Field Programmable Gate Arrays and Application Specific Integrated Circuits) for military and aerospace applications. The project will run 51-months and be perfo...