GlobeNewswire·Apr 30, 2026, 8:30 AM ET

Forge Nano to Showcase Industry-Leading Semiconductor ALD Coating Capabilities, Including 1000:1 High Aspect Ratio Innovation, to Leading Fabs in Malaysia

Forge Nano announced a technical semiconductor seminar in Kuala Lumpur, Malaysia, scheduled for May 6, 2026, from 3-5 pm at the Sofitel hotel.
The event will showcase technical data on Forge Nano's highly conformal Atomic Layer Deposition (ALD) coatings for applications in photonics, RF, MEMS devices, advanced packaging, & power semiconductors.
Malaysia is a critical global semiconductor node accounting for roughly 13% of global assembly, testing, & packaging, with major players including Intel, Infineon, AMD, Broadcom, NXP, & Micron.
Forge Nano demonstrated a technical milestone in high-speed ALD coatings capable of conformally covering structures with aspect ratios up to 1000:1 on production-representative wafers.
The company is building a production-ready ecosystem in Asia with a focus on local partnerships, service infrastructure, & supply chain support to accelerate adoption.
Forge Nano signed an agreement to merge with Archimedes Tech SPAC Partners II Co. (NASDAQ: ATII), valuing the company at approximately $1.2 billion on a pre-money basis.
The merger transaction is expected to result in a NASDAQ listing under the ticker "NANO" following a closing in the second half of 2026.
Wyman Fang, Chief Operating Officer of Forge Nano, stated the goal is to become a long-term partner in customers' manufacturing journeys through advanced technology & localized support.