InvenSense Announces New SensorStudio 2.1 Release With Support For New FireFly ICM-30670

SAN JOSE, Calif. & SHANGHAI--(BUSINESS WIRE)--InvenSense, Inc. (NYSE:INVN), a leading provider of MEMS sensor platforms, announced the new SensorStudio 2.1 release and the new ICM-30670 FireFly development kit, a sensor prototyping and development platform for Internet of Things (IoT) and drones applications. The InvenSense IoT development platform is comprised of InvenSense’s ICM-30670 MEMS 6-axis sensor (3-axis gyroscope + 3-axis accelerometer) with an integrated sensor framework software interfacing with an Arduino Zero board. The new ICM-30670 supports up to 1 kHz data rate to the host MCU satisfying the needs for high data throughput applications, such as drones. With SensorStudio and the FireFly development kit, developers are able to select and evaluate the FireFly embedded features (orientation, activity tracking, gestures, etc.), enable quick design and validate embedded features. The new InvenSense development platform simplifies even further, the configuration and extension of the FireFly SensorHub Framework, bringing a unique level of simplification and integration to build smart IoT applications faster.