PR Newswire·Jul 15, 2026, 9:05 AM ET

Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure

Super Micro Computer expanded its Rear Door Heat Exchanger (RDHx) portfolio to ten models supporting cooling capacities from 10kW to 120kW at the door level & up to 240kW at the rack level.
The expanded RDHx solutions provide flexible liquid cooling for high-density AI & HPC workloads in both new & legacy data centers without requiring major facility modifications.
RDHx units integrate seamlessly with standard EIA, ORv3, & MGX racks & can function as primary cooling or alongside Direct-to-Chip (D2C) technologies within the Data Center Building Block Solutions (DCBBS) framework.
Key deployment benefits include direct mounting to standard racks, intelligent fan control with N+1 redundancy, anti-condensation protection, & options for DC or AC power integration.
Infrastructure monitoring is enabled via Redfish®, SNMP, web-based management, & Supermicro SuperCloud Composer (SCC) to track temperature, pressure, flow rate, & pump status in real time.
The DCBBS approach offers validated rack-scale infrastructure, intelligent management software, & global deployment services to reduce integration risk & Time-to-Online (TTO).
Products are designed & manufactured in-house across the US, Taiwan, & the Netherlands to support Green Computing initiatives & reduce total cost of ownership (TCO).