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Teradyne Introduces Omnyx Edge, Inline Board Test for Physical and Edge AI

  • Teradyne introduces Omnyx Edge, an inline board test platform extending the Omnyx family from data centers to edge AI devices.
  • The platform tests compute, sensing, & motion boards used in automotive, robotic, & edge applications to catch defects before assembly.
  • Omnyx Edge covers three physical AI system layers: intelligence (AI compute modules), sensing (cameras, radar, lidar), & motion (power conversion, motor control).
  • Key features include boundary scan coverage for dense boards, PowerSense touchless PWM sensing, & LEDSense optical test coverage.
  • The system utilizes a modern PLC & HMI architecture for automated factory integration & includes AI-based preventive maintenance to protect uptime.
  • Omnyx Edge will be demonstrated at electronica 2026 in Munich from November 10-13, 2026, at Hall A4, Booth 431.
  • Teradyne now provides testing solutions for AI boards across the entire spectrum from the data center to physical edge devices.