Tessera Technologies and Micron Technology Announce Execution of New Technology and Patent License Agreements

SAN JOSE, Calif. & BOISE, Idaho--(BUSINESS WIRE)--Tessera Technologies, Inc. (NASDAQ: TSRA) ("Tessera" or the “Company") and Micron Technology, Inc. (“Micron”) (NASDAQ: MU) announced today the execution of new, multiyear technology and patent license agreements. In addition to the new patent license agreement, Tessera’s wholly-owned subsidiary Invensas Corporation will license its Multi-Die Face-Down (xFDTM) semiconductor packaging technology to Micron and cooperate with Micron on the manufacturing of Micron products that incorporate xFD technology. As part of the agreements, Tessera and Micron will also explore other possible joint development efforts.