UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers

Certification evaluates liquid cooling subassemblies for safety, performance, leak integrity and interoperability, helping support reliable AI infrastructure.

• AI chips generate intense heat, making effective cooling essential to data center performance and reliability.
• The certification provides a consistent way to assess critical cooling components before deployment in AI data centers.
• Certification can help manufacturers demonstrate product readiness and help data center customers make informed purchasing and integration decisions.

UL Solutions Inc. (NYSE:ULS), a global leader in applied safety science, today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.

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