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ESI Introduces Next Generation UV Laser Drilling Tool for Semiconductor Substrate Fabrication

PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the micro-machining industry, today introduced the CornerStone™ ICP Series 1 UV laser drilling system designed for use initially in Integrated Circuit Packaging (ICP) applications. Compared with typical laser drill tools, this new platform from ESI offers lower overall Cost of Ownership (CoO) and improved accuracy with a reduced footprint, enabling production of vias (Vertical Interconnect Access) for current and next-generation products.