ESI Introduces Next Generation UV Laser Drilling Tool for Semiconductor Substrate Fabrication
PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the micro-machining industry, today introduced the CornerStone™ ICP Series 1 UV laser drilling system designed for use initially in Integrated Circuit Packaging (ICP) applications. Compared with typical laser drill tools, this new platform from ESI offers lower overall Cost of Ownership (CoO) and improved accuracy with a reduced footprint, enabling production of vias (Vertical Interconnect Access) for current and next-generation products.
Laser systems are widely employed for drilling vias in organic substrate material used for ICPs, and are typically used for vias less than 100 micrometers (μm) in diameter. The CornerStone™ ICP Series 1 system meets today’s production demands and enables packaging manufacturers to meet design requirements for even smaller vias and higher accuracy required in the future.
“With this introduction, we are addressing existing design requirements while providing significantly lower cost of ownership in an industry-leading small footprint,” said Dr. Michael Darwin, Vice President and General Manager, ESI. “We are excited about the CoO advantage we can offer our customers and look forward to providing a complete and cost-effective solution to the via drilling market.”
Third Dynamics technology holds the key
In addition to the UV laser source, the CornerStone™ ICP Series 1 system incorporates ESI’s patented Third Dynamics technology (announced in March of 2013) in a multi-beam format. This technology provides per-beam drill rates that significantly outperform the typical high volume manufacturing (HVM) laser drill systems in operation today. The resulting productivity leads the industry and in turn significantly lowers customers’ cost of ownership.
As next-generation substrates push the requirements for line/space and signal routing, the target pad and via diameters will decrease. This will also require a corresponding improvement in via placement accuracy. In its standard configuration, the CornerStone™ ICP Series 1 offers industry-leading via placement accuracy, and can be extended for even smaller and denser via requirements in the future.
Another important factor in the Cost of Ownership equation is tool footprint. The CornerStone™ ICP Series 1 system has an overall footprint 25 percent smaller than typical laser drills in HVM production today. A considerably reduced footprint coupled with a significant productivity increase leads to substantial savings for fabricators as they build production lines for additional capacity.
Availability
Processing of customers samples using pre-production CornerStone™ ICP Series 1 systems is underway now at ESI development centers. System deliveries will begin in the first half of 2015.
About ESI, Inc.
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.